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ISSE OVERVIEW

The International Spring Seminar on Electronics Technology (ISSE) is one of the renowned conferences encompassing all topics around electronics technology and is attended every year by more than 100 experts and young researchers from all over the world.

ISSE - a series of annual conferences and a network of electronics packaging education - was founded in 1977 to provide a European forum for the exchange of information between senior and junior scientists from academic communities and electronic industries from around the world on topics related to their experimental and theoretical work in the very wide-spread field of electronics and microelectronics technology and packaging.
The theme of the upcoming 43rd ISSE conference is “Trends in Microelectronics Packaging and Interconnection Technology”. For almost two decades ISSE is technically co-sponsored by IEEE and participating scientists can profit from getting their papers published by the renowned library IEEE Xplore.

The main objectives of the ISSE are both, providing a forum for knowledge and information exchange on electronics technology, and, especially for young researchers, to encouraging them to develop their interest and engagement in the field of electrical engineering. ISSE provide top quality coverage of technological innovation in the field of electronics and microelectronics technology and packaging.

The ISSE 2020 will continue a long tradition of the preceding ISSE conference, starting by 1977 (Weissig / Germany) and the last one held in Wroclaw by Wroclaw University of Science and Technology (Poland, 2019). The ISSE 2020 will be hosted by the Technical University of Kosice, Faculty of Electrical Engineering and Informatics, Department of Technologies in Electronics. The organization of the ISSE conference is a great honor and opportunity for the Technical University of Kosice to present high-level scientific research.

Conference objectives

Topics of ISSE

Conference structure

Year

Venue

Theme

1977

Weissig - Germany 

Application of Mathematics in Electronics Technology

1978

Prenet - Czechoslovakia 

Reliability in Electronics

1979

Balatonfüred - Hungary 

Measurements in Electronics Technology

1980

Manebach - Germany

Hybrid Technology

1982

Prenet - Czechoslovakia 

1982 Physical Measuring Methods

1983

Balatonfüred - Hungary 

Research and Education in Microelectronics

1984

Geising - Germany 

Applications of Microprocessors in Technology

1985

Prenet - Czechoslovakia

Power Semiconductors, Hybrid Devices

1986

Balatonfüred - Hungary

Progress in Physical Measuring Methods on Electronics Technology

1987

Sozopol - Bulgaria 

Progress in Education in Hybrid Microelectronics

1988

Karsdorf - Germany

Progress in Surface Mount Technology

1989

Prenet - Czechoslovakia

Thermal Problems in Electronics Technology

1990

Göd - Hungary 

Computer Aided Electronics Technology

1991

Sozopol - Bulgaria

Total Quality Control in Hybrid Production

1992

Herlany - Slovak Republic

Higher Education in Electronic Technology

1993

Szklarska Poreba - Poland

Thick and Thin Film Sensors

1994

Weissig - Germany 

Process Technology of Electronics

1995

Temesvár - Czech Republic

Advanced Electronics Technology

1996

Göd - Hungary

Advanced Electronics Technology

1997

Szklarska Poreba - Poland

Education and Research in Microelectronics

1998

Neusiedl am See - Austria

Advanced Electronics Technology

1999

Freital - Germany

Driving Forces in Electronics Technology

2000

Balatonfüred - Hungary

Networking Electronics Packaging Education

2001

Calimanesti-Caciulata - Romania

Concurrent Engineering in Electronic Packaging

2002

Prague - Czech Republic

Quality Management and Diagnostics in Electronics Packaging

2003

High Tatras - Slovak Republic

Integrated Management of Electronic Materials Production

2004

Bankia / Sofia - Bulgaria 

Meeting the Challenges of Electronics Technology Progress

2005

Wiener Neustadt - Austria 

European Electronic Packaging Network

2006

St. Marienthal / Dresden - Germany

Nano-Technologies for Electronics Packaging

2007

Cluj-Napoca - Romania

Emerging Technologies for Electronics Packaging

2008

Budapest - Hungary

Reliability and Life-time Prediction

2009

Brno -Czech Republic

Technology Integration, the path to New Solutions in the Modern Electronics

2010

Warsaw - Poland

Polymer Electronics and Nanotechnologies: Towards System Integration

2011

Tatranská Lomnica - Slovak Republic

New Trends in Micro/Nanotechnology

2012

Bad Aussee - Austria

Power Electronics

2013

Alba Iulia - Romania

Automotive Electronics

2014

Dresden - Germany

Advances in Electronic System Integration

2015

Eger - Hungary

Novel Trends in Electronics Manufacturing

2016

Pilsen - Czech Republic

Printed electronics and smart textiles

2017

Sofia - Bulgaria

High-Tech Electronics for a Better Tomorrow - Theoretical and Practical Aspects

2018

Zlatibor - Serbia

Research and Development Tendencies in Advanced Electronics Technologies

2019

Wrocław - Poland

Advances in Printed and Ceramic Microsystems

isse

Designed by Pavlo Chabanenko